Microelectronics Packaging Handbook: Subsystem Packaging Part III

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Microelectronics Packaging Handbook: Subsystem Packaging Part III - Tummala, R R, and Rymaszewski, Eugene J, and Klopfenstein, Alan G
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This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent ...

Microelectronics Packaging Handbook: Subsystem Packaging Part III 1997, Springer, New York, NY

ISBN-13: 9780412084515

2nd 1997 edition

Hardcover

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