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1. Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
by Zhang, Shuye, and Sun, Guoli
Seller Description: New. Print on demand 198 p. Materials, Circuits and Devices . Intended for college/higher education audience. See More Details
2025, Institution of Engineering and Technology
ISBN-13: 9781837241408
Hardcover, New
NV, USA
$110.72
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2. Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
by Zhang, Shuye, and Sun, Guoli
Seller Description: New. 199 p. Materials, Circuits and Devices . Intended for college/higher education audience. See More Details
2025, Institution of Engineering and Technology
ISBN-13: 9781837241408
Hardcover, New
Southport, MERSEYSIDE, UNITED KINGDOM
$189.35
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3. Semiconductor Advanced Packaging
Seller Description: Brand New. New. See More Details
2022, Springer Verlag, Singapore
ISBN-13: 9789811613784
Paperback, New
New Delhi, DELHI, INDIA
$94.23
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4. Semiconductor Advanced Packaging
Seller Description: New, US edition. Satisfaction guaranteed! ! See More Details
2022, Springer Verlag, Singapore
ISBN-13: 9789811613784
Paperback, New
Irving, TX, USA
$99.33
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5. Semiconductor Advanced Packaging
Seller Description: Brand New. New. See More Details
2022, Springer Verlag, Singapore
ISBN-13: 9789811613784
Paperback, New
New Delhi, DELHI, INDIA
$101.75
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6. Semiconductor Advanced Packaging
by Lau, John H.
Seller Description: New. Print on demand Contains: Illustrations, black & white, Illustrations, color. XXII, 498 p. 557 illus., 530 illus. in color. Intended for professional and scholarly audience. See More Details
2022, Springer Verlag, Singapore
ISBN-13: 9789811613784
Paperback, New
NV, USA
$122.11
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7. Semiconductor Advanced Packaging
by Lau, John H.
Seller Description: New. Contains: Illustrations, black & white, Illustrations, color. XXII, 498 p. 557 illus., 530 illus. in color. Intended for professional and scholarly audience. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 ... See More Details
2022, Springer Verlag, Singapore
ISBN-13: 9789811613784
Paperback, New
Columbia, MD, USA
$131.06
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8. Semiconductor Advanced Packaging
by Lau, John H.
Seller Description: Fine. Contains: Illustrations, black & white, Illustrations, color. XXII, 498 p. 557 illus., 530 illus. in color. Intended for professional and scholarly audience. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 ... See More Details
2022, Springer Verlag, Singapore
ISBN-13: 9789811613784
Paperback, Fine/Like New
Columbia, MD, USA
$153.87
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9. Semiconductor Advanced Packaging
by Lau, John H.
Seller Description: Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book. See More Details
2022, Springer
ISBN-13: 9789811613784
paperback, Good
Santa Clarita, CA, USA
$153.88
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10. Semiconductor Advanced Packaging
by Lau, John H.
Seller Description: New. Contains: Illustrations, black & white, Illustrations, color. XXII, 498 p. 557 illus., 530 illus. in color. Intended for professional and scholarly audience. See More Details
2022, Springer Verlag, Singapore
ISBN-13: 9789811613784
Paperback, New
Uxbridge, MIDDLESEX, UNITED KINGDOM
$156.94
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11. Semiconductor Advanced Packaging
by Lau, John H.
Seller Description: New. See More Details
2022, Springer
ISBN-13: 9789811613784
paperback, New
Santa Clarita, CA, USA
$197.69
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12. Semiconductor Advanced Packaging
by John H. Lau
eBook See More Details
2021, Springer Nature
eBook ISBN: 9789811613753
Edition: 2021 edition
Format: EPUB eBook
Digital download
$38.70
