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Electromigration Modeling at Circuit Layout Level

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Electromigration Modeling at Circuit Layout Level - Tan, Cher Ming, and He, Feifei
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Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how ...

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Electromigration Modeling at Circuit Layout Level 2013, Springer Verlag, Singapore, Singapore

ISBN-13: 9789814451208

2013 edition

Paperback

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