Wafer Level 3-d ICs Process Technology

by

Write The First Customer Review

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

Wafer Level 3-D ICs Process Technology 2010, Springer-Verlag New York Inc., New York, NY

ISBN-13: 9781441945624

Paperback

Select
Wafer Level 3-D ICS Process Technology 2008, Springer

ISBN-13: 9780387765327

2009 edition

Hardcover

Select