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Through-Silicon Vias for 3D Integration

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Through-Silicon Vias for 3D Integration - Lau, John H, Dr.
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This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuitsessential for the development of low-cost, high-performance electronic and optoelectronic products.

Through-Silicon Vias for 3D Integration 2012, McGraw-Hill Education, New York

ISBN-13: 9780071785143

Hardcover

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