Simulation of Semiconductor Processes and Devices 2007: Sispad 2007

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The "Twelfth International Conference on Simulation of Semiconductor Processes and Devices" (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a ...

Simulation of Semiconductor Processes and Devices 2007: Sispad 2007 2017, Springer

ISBN-13: 9783709119112

Softcover Reprint of the Origi edition

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Simulation of Semiconductor Processes and Devices 2007: Sispad 2007 2007, Springer, Vienna, Austria

ISBN-13: 9783211728604

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