Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009: Volume 1156

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Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues ...

Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009: Volume 1156 2014, Cambridge University Press, New York

ISBN-13: 9781107408319

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