Hybrid Assemblies and Multichip Modules


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Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design ...

Hybrid Assemblies and Multichip Modules 1992, CRC Press, New York, NY

ISBN-13: 9780824784669