Fundamentals of Microsystems Packaging

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LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field's leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You'll find: ...

Fundamentals of Microsystems Packaging 2001, McGraw-Hill Education, New York, NY

ISBN-13: 9780071371698

Hardcover

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Fundamentals of Microsystems Packaging 2001, McGraw-Hill Education (ISE Editions), London

ISBN-13: 9780071203012

International student edition

Paperback

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