Force Sensors for Microelectronic Packaging Applications

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Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire ...

Force Sensors for Microelectronic Packaging Applications 2010, Springer-Verlag Berlin and Heidelberg GmbH & Co. K, Berlin

ISBN-13: 9783642060632

Paperback

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Force Sensors for Microelectronic Packaging Applications 2004, Springer, Berlin, Germany

ISBN-13: 9783540221876

2005 edition

Hardcover

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