Electronics Packaging Forum: Volume One

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This is the first volume of an annual monographic series devoted to the diverse aspects of electronics packaging technology. Each book is to be based on that year's presentations at the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T. J. Watson School of Engineering, Applied Science and Technology in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (University-Industry Partnership for Economic ...

Electronics Packaging Forum: Volume One 2012, Springer, Dordrecht

ISBN-13: 9789401092883

Softcover Reprint of the Origi edition

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Electronics Packaging Forum: Volume One 1990, Springer, Dordrecht

ISBN-13: 9780442001780

Hardcover

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