Electrical and Mechanical Properties of Mesoporous Silica Thin Films

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Mesoporous silica (MPS) thin films are attractive for application as low-??? interlayer dielectric (ILD) in integrated circuits. However these films are susceptible to instabilities in electrical behavior due to water uptake and copper diffusion. This work discusses the electrical, chemical, and thermal instabilities, Cu diffusion, and adhesion of these materials for evaluating and enabling their use for applications as future ILD in device wiring. Thermal stability of functional groups and adhesion of these films with Cu ...

Electrical and Mechanical Properties of Mesoporous Silica Thin Films 2011, LAP Lambert Academic Publishing, Saarbrucken

ISBN-13: 9783838367200

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