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Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have ...

Electrical Design of Through Silicon Via 2016, Springer

ISBN-13: 9789401779494

Softcover Reprint of the Origi edition

Trade paperback

Electrical Design of Through Silicon Via 2014, Springer

ISBN-13: 9789401790376

2014 edition