Chip Scale Package: Design, Materials, Process, Reliability, and Applications

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This text details current trends in CSP (Chip Scale Packaging) design and developments, covering each major type, chip scale and package developed by each major vendor, detailing the efficiency and cost effectiveness of different packages in varying applications.

Chip Scale Package: Design, Materials, Process, Reliability, and Applications 1999, McGraw-Hill Professional Publishing, New York, NY

ISBN-13: 9780070383043

Hardcover

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