Chemical-Mechanical Planarization of Semiconductor Materials

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This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Chemical-Mechanical Planarization of Semiconductor Materials 2010, Springer-Verlag Berlin and Heidelberg GmbH & Co. K, Berlin

ISBN-13: 9783642077388

Paperback

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Chemical-Mechanical Planarization of Semiconductor Materials 2004, Springer, Berlin, Germany

ISBN-13: 9783540431817

2004 edition

Hardcover

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