Area Array Packaging Handbook: Manufacturing and Assembly

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*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)

Area Array Packaging Handbook: Manufacturing and Assembly 2001, McGraw-Hill Professional Publishing

ISBN-13: 9780071374934

Hardcover

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