Technical leaders from around the world gather here to discuss developments in the areas of interconnect performance, advanced metallization, low-dielectric constant materials, barrier metallization, atomic layer deposition, advanced packaging and vertical integration. Both current state-of-the-art and ongoing challenges associated with multilevel interconnect are addressed. Included are papers on the latest developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in ...

Advanced Metallization Conference 2005 (AMC 2005): Volume 21 2006, Materials Research Society, Warrendale, Pittsburgh

ISBN-13: 9781558998650

Hardcover

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