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Advanced MEMS Packaging - Lau, John H, Dr., and Lee, Cheng Kuo, and Premachandran, C S
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An comprehensive guide to advanced MEMS packaging methods This book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging. Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenging problems created by the ever-increasing interests in MEMS devices and packaging. This authoritative guide is ideal for anyone who needs to choose a reliable, creative, high-performance, ...

Advanced MEMS Packaging 2009, McGraw-Hill Education, New York, NY

ISBN-13: 9780071626231

Hardcover

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