Adhesive Bonding in Photonics Assembly and Packaging

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Yacobi (U. of Toronto) and Hubert (Exfor Photonic Solutions, Canada) have expanded a review published in the Journal of Applied Physics on a subject crucial to a wide variety of applications in microelectronics and photonics assemblies and packaging and to the manufacturing of optoelectronic and fiber-optic components, and of medical devices. Photocuring of adhesives offers advantages related to its capabilities for instant cure, cure-on-demand, increased production speed, and ease of automation; but its use requires ...

Adhesive Bonding in Photonics Assembly and Packaging 2003, American Scientific Publishers

ISBN-13: 9781588830197

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