A collection of papers from the 1998 TMS Annual Meeting & Exhibition in San Antonio, Texas, February 15-19, 1998. Researchers should find this volume to be a current review of recent work in the modelling of both elastic and plastic material.
This work focuses on in-depth mechanics and materials aspects pertinent to the phenomena of ductile fracture in engineering materials. The 31 papers present recent advances that provide an increased level of understanding of many aspects of this type of fracture, including micromechanisms of fracture, sources of toughness, the effects of ...
The reliability of solders and solder joints is an important factor in the durability and design of electronic packages. This volume addresses issues of reliability such as microstructural stability in service, creep, fatigue, creep/fatigue interactions, and thermomechanical fatigue of bulk solders and solder joints. This is a collection of papers ...
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