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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys.
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by
Dr. Istvan Maros, Erdogan Madenci, Ibrahim Guven
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS. describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS. that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are ...
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