Pulsed and Pulsed Bias Sputtering: Principles and Applications

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Pulsed and Pulsed Bias Sputtering: Principles and Applications - Barnat, Edward V., and Lu, Toh-Ming

Diffusion Barrier Stack - 5 nm -3 nm -2 nm :...-...: . . O. 21-lm Figure 2: Schematic representing a cross-sectional view of the topography that is encountered in the processing of integrated circuits. (Not to scale) these sub-micron sized features is depicted in Fig. 2. The role of the diffusion barrier is to prevent the diffusion of metallic ...

Pulsed and Pulsed Bias Sputtering: Principles and Applications 2014, Springer-Verlag New York Inc., New York, NY

ISBN-13: 9781461350637

Paperback

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Pulsed and Pulsed Bias Sputtering: Principles and Applications 2003, Springer, Boston, MA

ISBN-13: 9781402075438

2003 edition

Hardcover

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